agilent ada-4743 silicon bipolar darlington amplifier data sheet description agilent technologies ada-4743 is an economical, easy-to-use, general purpose silicon bipolar rfic gain block amplifiers housed in a 4-lead sc-70 (sot-343) surface mount plastic package which requires only half the board space of a sot-143 package. the darlington feedback struc- ture provides inherent broad bandwidth performance, result- ing in useful operating frequency up to 2.5 ghz. this is an ideal device for small-signal gain cascades or if amplification. ada-4743 is fabricated using agilents hp25 silicon bipolar process, which employs a double- diffused single polysilicon process with self-aligned submicron emitter geometry. the process is capable of simulta- neous high f t and high npn breakdown (25 ghz f t at 6v bvceo). the process utilizes industry standard device oxide isolation technologies and submicron aluminum multilayer interconnect to achieve superior performance, high uniformity, and proven reliability. features small signal gain amplifier operating frequency dc ?2.5 ghz unconditionally stable 50 ohms input & output flat, broadband frequency response up to 1 ghz operating current: 40 to 80 ma industry standard sot-343 package lead-free option available specifications 900 mhz, 3.8v, 60 ma (typ.) 16.5 db associated gain 17.1 dbm p 1db 32.6 dbm oip 3 4.2 db noise figure vswr < 2 throughput operating frequency single supply, typical i d = 60 ma applications cellular/pcs/wll base stations wireless data/wlan fiber-optic systems ism surface mount package sot-343 pin connections and package marking rfin 3tx gnd rfout & vd gnd note: top view. package marking provides orientation and identification. ?t? = device code ?? = date code character identifies month of manufacture. c block c block c bypass r c v cc = 5 v v d = 3.8 v rfc rf input rf output 3tx r c = v cc - v d i d typical biasing configuration attention: observe precautions for handling electrostatic sensitive devices. esd machine model (class a) esd human body model (class 1b) refer to agilent application note a004r: electrostatic discharge damage and control.
2 ada-4743 absolute maximum ratings [1] absolute symbol parameter units maximum i d device current ma 90 p diss total power dissipation [2] mw 370 p in max. rf input power dbm 20 t j channel temperature c 150 t stg storage temperature c -65 to 150 jc thermal resistance [3] c/w 163 notes: 1. operation of this device above any one of these parameters may cause permanent damage. 2. ground lead temperature is 25 c. derate 6.1 mw/ c for tl >89 c . 3. junction-to-case thermal resistance measured using 150 c liquid crystal measurement method. ada-4743 electrical specifications t a = 25 c, zo=50 ? , pin = -25 dbm, i d = 60 ma (unless specified otherwise) symbol parameter and test condition: frequency units min. typ. max. std. dev. i d = 60 ma, zo = 50 ? v d device voltage i d = 60 ma v 3.3 3.8 4.3 gp power gain (|s 21 | 2 100 mhz db 16.6 900 mhz [1,2] 15 16.5 18 ? gp gain flatness 100 to 900 mhz db 0.5 0.1 to 2 ghz 1.5 f 3db 3 db bandwidth ghz 4 vswr in input voltage standing wave ratio 0.1 to 6 ghz 1.7:1 vswr out output voltage standing wave ratio 0.1 to 6 ghz 1.5:1 nf 50 ? noise figure 100 mhz db 4.1 0.11 900 mhz [1,2] 4.2 0.16 p 1db output power at 1db gain compression 100 mhz dbm 17.7 900 mhz [1,2] 17.1 oip 3 output 3 rd order intercept point 100 mhz [3] dbm 33.4 900 mhz [1,2,3] 32.6 dv/dt device voltage temperature coefficient mv/ c -4.9 notes: 1. typical value determined from a sample size of 500 parts from 3 wafers. 2. measurement obtained using production test board described in the block diagram below. 3. i) 900 mhz oip 3 test condition: f1 = 900 mhz, f2 = 905 mhz and pin = -25 dbm per tone. ii) 100 mhz oip 3 test condition: f1 = 100 mhz, f2 = 105 mhz and pin = -25 dbm per tone. block diagram of 900 mhz production test board used for v d , gain, p 1db , oip 3 , and nf measurements. circuit losses have been de-embedded from actual measurements. input 50 ohm transmission (0.5 db loss) dut 50 ohm transmission including bias (0.5 db loss) output
3 ada-4743 typical performance curves (at 25 c, unless specified otherwise) product consistency distribution charts at 900 mhz, i d = 60 ma notes: 1. statistics distribution determined from a sample size of 500 parts taken from 3 different wafers. 2. future wafers allocated to this product may have typical values anywhere between the minimum and maximum specification limits . gain (db) 15 1 8 16 15.5 17 16.5 17.5 300 250 200 150 100 50 0 figure 1. gain distribution @ 60 ma. lsl = 15, nominal = 16.5, usl = 18 v d (v) 3.3 4.3 3.5 3.7 3.9 4.1 240 200 160 120 80 40 0 figure 2. v d distribution @ 60 ma. lsl = 3.3, nominal = 3.8, usl =4.3 frequency (ghz) figure 3. gain vs. frequency at i d = 60 ma. gain (db) frequency (ghz) figure 4. p 1db vs. frequency at i d = 60 ma. frequency (ghz) figure 5. oip 3 vs. frequency at i d = 60 ma. frequency (ghz) figure 6. nf vs. frequency at i d = 60 ma. v d (v) figure 7. i d vs. v d and temperature. i d (ma) figure 8. gain vs. i d and temperature at 900 mhz. gain (db) p 1db (dbm) oip 3 (dbm) nf (db) i d (ma) 06 2 1 3 5 4 20 15 10 5 0 06 2 1 3 5 4 20 15 10 5 0 06 2 1 3 5 4 35 30 25 20 15 10 06 2 1 3 5 4 6 5 4 3 2 05 2 1 3 4 90 80 70 60 50 40 30 20 10 0 -40 c 25 c 85 c 0 100 20 40 80 60 17 16.5 16 15.5 15 14.5 14 -40 c 25 c 85 c
4 ada-4743 typical performance curves (at 25 c, unless specified otherwise) , continued i d (ma) figure 9. p 1db vs. i d and temperature at 900 mhz. p 1db (dbm) i d (ma) figure 10. oip 3 vs. i d and temperature at 900 mhz. oip 3 (dbm) i d (ma) figure 11. nf vs. i d and temperature at 900 mhz. nf (db) i d (ma) figure 12. gain vs. i d and frequency (ghz). gain (db) i d (ma) figure 13. p 1db vs. i d and frequency (ghz). p 1db (dbm) i d (ma) figure 14. oip 3 vs. i d and frequency (ghz). oip3 (dbm) i d (ma) figure 15. nf vs. i d and frequency (ghz). nf (db) frequency (ghz) figure 16. input return loss vs. i d and frequency. irl (db) frequency (ghz) figure 17. output return loss vs. i d and frequency. orl (db) 5.5 5 4.5 4 3.5 0 100 20 40 80 60 20 15 10 5 0 -40 c 25 c 85 c 0 100 20 40 80 60 40 35 30 25 20 15 10 -40 c 25 c 85 c 0 100 20 40 80 60 6 5 4 3 2 1 0 -40 c 25 c 85 c 0 100 20 40 60 80 18 17 16 15 14 13 12 11 10 9 0.1 0.5 0.9 1.5 2.0 2.5 3 4 5 6 0 100 20 40 80 60 25 20 15 10 5 0 0.1 0.5 0.9 1.5 2.0 2.5 3 4 5 6 0 100 20 40 80 60 0.1 0.5 0.9 1.5 2.0 2.5 3 4 5 6 0 100 20 40 80 60 38 33 28 23 18 13 0.1 0.5 0.9 1.5 2.0 2.5 3 4 5 6 012 4 2 6 8 10 0 -5 -10 -15 -20 -25 id=50 ma id=60 ma id=80 ma 012 4 2 6 8 10 0 -5 -10 -15 -20 -25 id=50 ma id=60 ma id=80 ma
5 ada-4743 typical scattering parameters, t a = 25 c, i d = 50 ma freq. s 11 s 21 s 12 s 22 k ghz mag. ang. db mag. ang. mag. ang. mag. ang. 0.1 0.11 0.7 16.59 6.751 176.1 0.1 -0.8 0.192 -5.6 1.1 0.5 0.136 12.2 16.45 6.644 160.8 0.098 -3.9 0.191 -17.2 1.1 0.9 0.203 14.9 16.13 6.406 145.9 0.094 -6.2 0.214 -26.3 1.1 1.0 0.214 11.8 16.04 6.336 142.5 0.093 -6.4 0.218 -29.65 1.1 1.5 0.262 -4.1 15.57 6.002 125.7 0.09 -7 0.232 -46.8 1.1 1.9 0.278 -13.9 15.22 5.767 112.9 0.088 -6.8 0.232 -60.6 1.2 2.0 0.284 -16.6 15.14 5.718 109.8 0.088 -6.7 0.231 -64 1.2 2.5 0.289 -28.7 14.75 5.467 94.4 0.087 -5.7 0.221 -81.8 1.2 3.0 0.281 -40.4 14.38 5.239 79.4 0.089 -4.6 0.209 -102.3 1.2 3.5 0.265 -53.8 14.01 5.017 64.2 0.092 -3.6 0.204 -125.6 1.2 4.0 0.239 -70.5 13.63 4.804 49.3 0.098 -3.1 0.215 -149.2 1.2 4.5 0.218 -90.6 13.24 4.594 34.4 0.105 -3.4 0.244 -170.4 1.1 5.0 0.204 -114.3 12.74 4.334 19.5 0.114 -4.9 0.276 172.3 1.1 5.5 0.206 -140 12.24 4.093 5.1 0.125 -7.3 0.309 158.4 1.0 6.0 0.219 -163.7 11.67 3.833 -9.5 0.137 -11 0.338 145.1 1.0 6.5 0.225 172.6 11.13 3.603 -23.8 0.152 -15.8 0.364 130.2 0.9 7.0 0.237 147.8 10.52 3.359 -38.2 0.167 -22.1 0.393 113.5 0.9 7.5 0.263 121.8 9.82 3.096 -52.6 0.179 -29.4 0.427 96.2 0.9 8.0 0.307 97.6 8.99 2.814 -66.6 0.188 -37.2 0.462 79.1 0.9 8.5 0.345 78.9 7.97 2.504 -79.1 0.194 -44.4 0.501 65.4 0.9 9.0 0.4 63.8 7.08 2.259 -91 0.202 -50.8 0.541 54.3 0.9 9.5 0.45 50.6 6 1.995 -102.8 0.21 -57.9 0.583 44.3 0.9 10.0 0.496 40 5.05 1.79 -113.5 0.215 -65.1 0.62 35.7 0.9 notes: 1. s-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. the input reference plane is at the end of the input lead. the output reference plane is at the end of the output lead.
6 notes: 1. s-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. the input reference plane is at the end of the input lead. the output reference plane is at the end of the output lead. ada-4743 typical scattering parameters, t a = 25 c, i d = 60 ma freq. s 11 s 21 s 12 s 22 k ghz mag. ang. db mag. ang. mag. ang. mag. ang. 0.1 0.102 0.5 16.7 6.836 176.1 0.099 -0.8 0.183 -5.6 1.1 0.5 0.131 14.2 16.56 6.73 160.7 0.097 -3.8 0.182 -17 1.1 0.9 0.199 16.3 16.24 6.489 145.8 0.094 -6 0.207 -25.9 1.1 1.0 0.204 13.3 16.15 6.418 142.3 0.093 -6.3 0.212 -29 1.1 1.5 0.257 -3.2 15.68 6.08 125.5 0.089 -6.8 0.225 -46.4 1.1 1.9 0.275 -12.9 15.33 5.84 112.7 0.088 -6.6 0.226 -60.3 1.2 2.0 0.28 -15.8 15.25 5.786 109.6 0.087 -6.5 0.225 -63.7 1.2 2.5 0.287 -27.7 14.85 5.529 94.2 0.087 -5.5 0.216 -81.7 1.2 3.0 0.279 -39.9 14.48 5.296 79 0.089 -4.3 0.205 -102.4 1.2 3.5 0.261 -53.6 14.09 5.066 63.9 0.092 -3.3 0.2 -126 1.2 4.0 0.238 -70.2 13.71 4.846 49 0.097 -2.8 0.212 -149.7 1.2 4.5 0.217 -91.2 13.31 4.631 34.1 0.105 -3 0.243 -170.9 1.1 5.0 0.201 -115.4 12.8 4.363 19.1 0.114 -4.6 0.275 171.8 1.1 5.5 0.205 -141 12.3 4.121 4.6 0.125 -6.9 0.308 157.8 1.0 6.0 0.216 -164.8 11.72 3.853 -9.9 0.138 -10.7 0.338 144.6 1.0 6.5 0.223 171.4 11.17 3.617 -24.2 0.152 -15.5 0.365 129.7 0.9 7.0 0.238 146.1 10.55 3.369 -38.6 0.167 -21.9 0.394 113 0.9 7.5 0.264 120.4 9.83 3.102 -52.9 0.18 -29.3 0.429 95.7 0.9 8.0 0.309 96.1 8.99 2.816 -66.9 0.189 -37.1 0.464 78.7 0.9 8.5 0.347 78.1 7.97 2.502 -79.4 0.195 -44.4 0.503 65 0.9 9.0 0.405 63.3 7.07 2.258 -91.1 0.202 -50.7 0.543 53.9 0.9 9.5 0.449 49.6 5.99 1.992 -103.1 0.21 -57.8 0.585 43.9 0.9 10.0 0.499 39.5 5.06 1.79 -113.6 0.216 -65.1 0.622 35.4 0.9
7 ada-4743 typical scattering parameters, t a = 25 c, i d = 80 ma freq. s 11 s 21 s 12 s 22 k ghz mag. ang. db mag. ang. mag. ang. mag. ang. 0.1 0.093 1.2 16.81 6.929 176.1 0.098 -0.7 0.172 -5.6 1.1 0.5 0.123 16.5 16.68 6.824 160.6 0.096 -3.7 0.172 -16.7 1.1 0.9 0.195 18.4 16.36 6.58 145.6 0.093 -5.7 0.197 -25.2 1.1 1.0 0.201 15 16.27 6.51 142 0.092 -6.1 0.203 -28.4 1.1 1.5 0.253 -1.9 15.8 6.164 125.1 0.089 -6.6 0.217 -45.9 1.1 1.9 0.271 -12.3 15.44 5.916 112.2 0.087 -6.3 0.218 -59.8 1.2 2.0 0.278 -15.2 15.36 5.863 109 0.087 -6.2 0.218 -63.3 1.2 2.5 0.286 -27.3 14.96 5.595 93.4 0.087 -5.1 0.21 -81.5 1.2 3.0 0.278 -40 14.57 5.353 78.2 0.088 -3.8 0.2 -102.5 1.2 3.5 0.261 -54 14.17 5.113 62.9 0.092 -2.8 0.196 -126.5 1.2 4.0 0.235 -71.8 13.77 4.882 47.9 0.098 -2.2 0.209 -150.5 1.2 4.5 0.214 -93.2 13.36 4.654 32.8 0.106 -2.5 0.241 -171.9 1.1 5.0 0.198 -118 12.81 4.371 17.8 0.115 -4.2 0.274 170.7 1.1 5.5 0.205 -144.6 12.29 4.116 3.2 0.126 -6.6 0.307 156.7 1.0 6.0 0.218 -169 11.67 3.835 -11.4 0.139 -10.5 0.337 143.4 1.0 6.5 0.228 167.1 11.09 3.584 -25.7 0.154 -15.5 0.364 128.5 0.9 7.0 0.244 142 10.45 3.329 -40 0.169 -22 0.393 111.7 0.9 7.5 0.272 117.4 9.69 3.053 -54.3 0.181 -29.5 0.427 94.4 0.9 8.0 0.32 94 8.84 2.767 -68.2 0.19 -37.3 0.462 77.5 0.9 8.5 0.358 75.8 7.81 2.457 -80.5 0.196 -44.5 0.5 64 0.9 9.0 0.413 62 6.9 2.213 -91.9 0.202 -50.9 0.54 53 0.9 9.5 0.46 48.2 5.78 1.946 -103.9 0.21 -58 0.582 43.2 0.9 10.0 0.507 38 4.83 1.744 -114.2 0.216 -65.1 0.619 34.8 0.9 notes: 1. s-parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. the input reference plane is at the end of the input lead. the output reference plane is at the end of the output lead.
8 package dimensions outline 43 sot-343 (sc70 4-lead) ordering information part number no. of devices container ada-4743-tr1 3000 7 reel ada-4743-tr2 10000 13 reel ada-4743-blk 100 antistatic bag ADA-4743-TR1G 3000 7 reel ada-4743-tr2g 10000 13 reel ada-4743-blkg 100 antistatic bag note: for lead-free option, the part number will have the character g at the end. recommended pcb pad layout for agilent s sc70 4l/sot-343 products he d a2 a1 b b1 e 1.30 bsc c l a dimensions (mm) min. 1.15 1.85 1.80 0.80 0.80 0.00 0.25 0.55 0.10 0.10 max. 1.35 2.25 2.40 1.10 1.00 0.10 0.40 0.70 0.20 0.46 symbol e d he a a2 a1 b b1 c l notes: 1. all dimensions are in mm. 2. dimensions are inclusive of plating. 3. dimensions are exclusive of mold flash & metal burr. 4. all specifications comply to eiaj sc70. 5. die is facing up for mold and facing down for trim/form, ie: reverse trim/form. 6. package surface to be mirror finish. 1.30 0.051 0.60 0.024 0.9 0.035 dimensions in mm inches 1.15 0.045 2.00 0.079 1.00 0.039
device orientation tape dimensions for outline 4t for product information and a complete list of agilent contacts and distributors, please go to our web site. www.agilent.com/semiconductors e-mail: semiconductorsupport@agilent.com data subject to change. copyright ? 2004 2005 agilent technologies, inc. obsoletes 5989-1976en september 28, 2005 5989-3754en user feed direction cover tape carrier tape reel end view 8 mm 4 mm top view p p 0 p 2 f w c d 1 d e a 0 10 max. t 1 (carrier tape thickness) t t (cover tape thickness) 10 max. b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.40 0.10 2.40 0.10 1.20 0.10 4.00 0.10 1.00 + 0.25 0.094 0.004 0.094 0.004 0.047 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.50 0.10 4.00 0.10 1.75 0.10 0.061 + 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 + 0.30 - 0.10 0.254 0.02 0.315 + 0.012 0.0100 0.0008 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance width tape thickness c t t 5.40 0.10 0.062 0.001 0.205 + 0.004 0.0025 0.0004 cover tape
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